Reliability and failure analysis of high-power led packaging.

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...

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Bibliographic Details

Main Author:	Tan, Cher Ming
Corporate Author:	ScienceDirect (Online service)
Other Authors:	Singh, Preetpal
Format:	eBook
Language:	English
Published:	Cambridge, MA : Woodhead Publishing Limited, 2022.
Series:	Woodhead Publishing series in electronic and optical materials
Subjects:	Reliability (Engineering) Failure analysis (Engineering) Light emitting diodes > Reliability. Packaging. Fiabilité. Analyse des défaillances (Ingénierie) Diodes électroluminescentes > Fiabilité. Conditionnement (Emballage) packaging. Light emitting diodes > Reliability Packaging Electronic books.
Online Access:	Connect to the full text of this electronic book