TSV 3D RF integration : high resistivity Si interposer technology /
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed...
| Main Authors: | , |
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Amsterdam, Netherlands :
Elsevier,
2022.
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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