TSV 3D RF integration : high resistivity Si interposer technology /

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed...

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Bibliographic Details

Main Authors:	Ma, Shenglin (Author), Jin, Yufeng (Author)
Corporate Author:	ScienceDirect (Online service)
Format:	eBook
Language:	English
Published:	Amsterdam, Netherlands : Elsevier, 2022.
Subjects:	Three-dimensional integrated circuits. Silicon > Electric properties. Radio frequency integrated circuits. Circuits intégrés tridimensionnels. Circuits intégrés à radiofréquence. Radio frequency integrated circuits Silicon > Electric properties Three-dimensional integrated circuits Electronic books.
Online Access:	Connect to the full text of this electronic book