Advances in chemical mechanical planarization (CMP) /

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...

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Bibliographic Details

Corporate Author:	ScienceDirect (Online service)
Other Authors:	Babu, S. V. (Editor)
Format:	eBook
Language:	English
Published:	Duxford, United Kingsom : Woodhead Publishing, 2022.
Edition:	Second edition.
Series:	Woodhead Publishing series in electronic and optical materials.
Subjects:	Chemical mechanical planarization. Semiconductors > Materials. Planarisation chimicomécanique. Semi-conducteurs > Matériaux. Chemical mechanical planarization Semiconductors > Materials Electronic books.
Online Access:	Connect to the full text of this electronic book