Modeling, analysis, design, and tests for electronics packaging beyond Moore /

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D.

Bibliographic Details

Main Authors:	Zhang, Hengyun (Author), Che, Faxing (Author), Lin, Tingyu (Author), Zhao, Wensheng (Author)
Corporate Author:	ScienceDirect (Online service)
Format:	eBook
Language:	English
Published:	Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
Series:	Woodhead Publishing series in electronic and optical materials. Series on advanced electronic packaging technology and key materials.
Subjects:	Electronic apparatus and appliances > Packaging. Appareils électroniques > Emballage. Electronic apparatus and appliances > Packaging Electronic books.
Online Access:	Connect to the full text of this electronic book