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Advanced adhesives in electronics : materials, properties and applications /

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and pr...

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Bibliographic Details
Corporate Author: ScienceDirect (Online service)
Other Authors: Alam, M. O., Bailey, C.
Format: eBook
Language:English
Published: Cambridge : Woodhead Pub., 2011.
Series:Woodhead Publishing in materials.
Subjects:
Electronics > Materials.
Coatings.
Sealing compounds.
Électronique > Matériaux.
Revêtements.
Produits d'étanchéité.
coating (material)
caulking compound.
TECHNOLOGY & ENGINEERING > Mechanical.
Sealing compounds
Coatings
Adhesive joints
Adhesives
Electronic packaging > Materials
Electronics > Materials
Electronic books.
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Holdings details from Available Online
Call Number: TK7871 .A38 2011
 
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TK7871 .A38 2011 Available