Plasma etching processes for interconnect realization in VLSI /

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.

Bibliographic Details

Corporate Author:	ScienceDirect (Online service)
Other Authors:	Posseme, Nicolas (Editor)
Format:	eBook
Language:	English
Published:	London : Oxford : ISTE Press ; Elsevier Ltd, 2015.
Subjects:	Integrated circuits > Very large scale integration. Plasma etching. Molded interconnect devices. Circuits intégrés à très grande échelle. Gravure par plasma. TECHNOLOGY & ENGINEERING > Mechanical. Integrated circuits > Very large scale integration Molded interconnect devices Plasma etching Electronic books.
Online Access:	Connect to the full text of this electronic book