Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling /

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, auto...

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Bibliographic Details
Main Author: Sha, Wei
Corporate Author: ScienceDirect (Online service)
Other Authors: Wu, Xiaomin, Keong, K. G. (Kim Ghee)
Format: eBook
Language:English
Published: Cambridge, UK ; Philadelphia, PA : Woodhead Pub., 2011.
Series:Woodhead Publishing in materials.
Subjects:
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Call Number: TS690 .S53 2011
 
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TS690 .S53 2011 Available