Advances in CMP/polishing technologies for the manufacture of electronic devices /

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.

Bibliographic Details
Corporate Author: ScienceDirect (Online service)
Other Authors: Doi, Toshiro (Editor), Marinescu, Ioan D. (Editor), Kurokawa, Syuhei (Editor)
Format: eBook
Language:English
Published: Oxford : William Andrew, 2012.
Edition:1st ed.
Subjects:
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Call Number: TS670 .A386 2012eb
 
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TS670 .A386 2012eb Available