Electromigration in thin films and electronic devices : materials and reliability /

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part on...

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Bibliographic Details

Corporate Author:	ScienceDirect (Online service)
Other Authors:	Kim, Choong-Un
Format:	eBook
Language:	English
Published:	Oxford : Woodhead Pub., 2011.
Series:	Woodhead Publishing in materials.
Subjects:	Thin films. Couches minces. TECHNOLOGY & ENGINEERING > Mechanical. Thin films Electronic books.
Online Access:	Connect to the full text of this electronic book