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Characterization of integrated circuit packaging materials /

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Bibliographic Details
Corporate Author: ScienceDirect (Online service)
Other Authors: Moore, Thomas M., McKenna, Robert G.
Format: eBook
Language:English
Language Notes:English.
Published: Boston : Butterworth-Heinemann, ©1993.
Series:Materials characterization series.
Subjects:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Mise sous boîtier (Électronique) > Matériaux.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Integrated circuits > Design and construction
Electronic equipment > Packaging
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Physical Description:1 online resource (xviii, 274 pages) : illustrations
Format:Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Bibliography:Includes bibliographical references and index.
ISBN:9781483292342
1483292347