Characterization of integrated circuit packaging materials /

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Bibliographic Details

Corporate Author:	ScienceDirect (Online service)
Other Authors:	Moore, Thomas M., McKenna, Robert G.
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boston : Butterworth-Heinemann, ©1993.
Series:	Materials characterization series.
Subjects:	Electronic packaging > Materials. Integrated circuits > Design and construction. Mise sous boîtier (Électronique) > Matériaux. Circuits intégrés > Conception et construction. TECHNOLOGY & ENGINEERING > Mechanical. Electronic packaging > Materials Integrated circuits > Design and construction Electronic equipment > Packaging Electronic books.
Online Access:	Connect to the full text of this electronic book