Adhesives technology for electronic applications : materials, processes, reliability /

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...

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Bibliographic Details
Main Author: Licari, James J., 1930-
Corporate Author: ScienceDirect (Online service)
Other Authors: Swanson, Dale W.
Format: eBook
Language:English
Published: Norwich, NY : William Andrew Pub., ©2005.
Series:Materials and processes for electronic applications series.
Subjects:
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Call Number: TK7871 .L53 2005
 
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TK7871 .L53 2005 Available