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Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /

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Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...

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Bibliographic Details
Main Author: Lee, Ning-Cheng
Corporate Author: ScienceDirect (Online service)
Format: eBook
Language:English
Published: Boston : Newnes, ©2002.
Subjects:
Electronic apparatus and appliances > Design and construction.
Solder and soldering.
Electronic packaging.
Electric connectors.
Appareils électroniques > Conception et construction.
Soudure.
Mise sous boîtier (Électronique)
solder.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electric connectors
Electronic apparatus and appliances > Design and construction
Electronic packaging
Solder and soldering
Electronic books.
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Call Number: TK7836 .L43 2002eb
 
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TK7836 .L43 2002eb Available