Stochastic finite element modeling in electronic packaging /

An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numeri...

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Bibliographic Details

Main Author:	Chu, Liu (Materials scientist) (Author)
Format:	eBook
Language:	English
Published:	Hoboken, New Jersey : John Wiley & Sons, Inc., [2026]
Subjects:	Artificial intelligence > Industrial applications. Electronic packaging > Data processing. Electronic packaging. Engineering. Materials science. Mathematics. Probabilities. Stochastic processes. Technology. Electronic books.
Online Access:	Connect to the full text of this electronic book