Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /

Bibliographic Details
Corporate Authors:	International Thermal Conductivity Conference Logan, Utah, Knovel (Firm), International Thermal Expansion Symposium
Other Authors:	Ban, Heng (Editor)
Format:	Conference Proceeding eBook
Language:	English
Published:	Lancaster, PA : DEStech Publications, 2018.
Subjects:	Heat > Conduction > Congresses. Heat > Conduction > Measurement > Methodology > Congresses. Materials > Thermal properties > Congresses. Materials > Thermal properties > Measurement > Methodology > Congresses. Expansion (Heat) > Congresses. Expansion (Heat) > Measurement > Methodology > Congresses. Chaleur > Conduction > Congrès. Matériaux > Propriétés thermiques > Congrès. Dilatation (Thermodynamique) > Congrès. Expansion (Heat) Heat > Conduction. Materials > Thermal properties. Electronic books. Conference papers and proceedings.
Online Access:	Connect to the full text of this electronic book

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