Thermal conductivity 34 : thermal expansion 22 : joint conferences, June 17-20, 2019, Hotel du Pont, Wilmington, Delaware, USA /

Bibliographic Details
Corporate Authors:	International Thermal Conductivity Conference Wilmington, Del., Knovel (Firm), International Thermal Expansion Symposium
Other Authors:	McCaffrey, John (Editor), Saienga, Jason (Editor)
Format:	Conference Proceeding eBook
Language:	English
Published:	Lancaster, Pennsylvania : DEStech Publications, 2021.
Subjects:	Heat > Conduction > Congresses. Materials > Thermal properties > Congresses. Expansion (Heat) > Congresses. Chaleur > Conduction > Congrès. Matériaux > Propriétés thermiques > Congrès. Dilatation (Thermodynamique) > Congrès. Expansion (Heat) Heat > Conduction. Materials > Thermal properties. Electronic books. Conference papers and proceedings.
Online Access:	Connect to the full text of this electronic book

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