Through silicon vias : materials, models, design, and performance /

Bibliographic Details

Main Author:	Kaushik, Brajesh Kumar (Author)
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Boca Raton : Taylor & Francis, CRC Press, [2017]
Subjects:	Interconnects (Integrated circuit technology) Three-dimensional integrated circuits. Interconnexions (Technologie des circuits intégrés) Circuits intégrés tridimensionnels. Three-dimensional integrated circuits Electronic books.
Online Access:	Connect to the full text of this electronic book