Cover Image

Thermal design of electronic equipment /

Show other versions (1)

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat trans...

Full description

Bibliographic Details
Main Author: Remsburg, Ralph
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Language Notes:English.
Published: Boca Raton, Fla. : CRC Press, ©2001.
Series:Electronics handbook series.
Subjects:
Electronic apparatus and appliances > Thermal properties.
Electronic apparatus and appliances > Design and construction.
Heat > Transmission.
Electronic packaging.
Appareils électroniques > Conception et construction.
Chaleur > Transmission.
Mise sous boîtier (Électronique)
heat transmission.
Electronic apparatus and appliances > Design and construction
Electronic apparatus and appliances > Thermal properties
Electronic packaging
Heat > Transmission
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and.
Physical Description:1 online resource (395 pages)
Bibliography:Includes bibliographical references and index.
ISBN:1315220024
9781315220024
1280482737
9781280482731
9786610482733
661048273X
142004236X
9781420042368