Thermal design of electronic equipment /

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat trans...

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Bibliographic Details

Main Author:	Remsburg, Ralph
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boca Raton, Fla. : CRC Press, ©2001.
Series:	Electronics handbook series.
Subjects:	Electronic apparatus and appliances > Thermal properties. Electronic apparatus and appliances > Design and construction. Heat > Transmission. Electronic packaging. Appareils électroniques > Conception et construction. Chaleur > Transmission. Mise sous boîtier (Électronique) heat transmission. Electronic apparatus and appliances > Design and construction Electronic apparatus and appliances > Thermal properties Electronic packaging Heat > Transmission Electronic books.
Online Access:	Connect to the full text of this electronic book