Microengineering, MEMS, and interfacing : a practical guide /
MICROMACHINING. IntroductionPhotolithography. Introduction. UV Photolithography. X-Ray Lithography. Direct-Write (E-Beam) Lithography. Low-Cost Photolithography. Photolithography-Key Points. ReferencesSilicon Micromachining. Introduction. Silicon. Crystal Growth. Doping. Wafer Specifications. Thin F...
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Boca Raton, FL :
Dekker/CRC Press,
2006.
|
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- "Front cover"; "Acknowledgments"; "The Author"; "Table of Contents"; "Part I"; "Micromachining"; "I.1. INTRODUCTION"; "I.1.1 What Is Microengineering?"; "I.1.2 Why Is Microengineering Important?"; "I.1.3 How Can I Make Money out of Microengineering?"; "REFERENCES"; "Chapter 1"; "Photolithography"; "1.1 Introduction"; "1.2 UV Photolithography"; "1.2.1 UV Exposure Systems"; "1.2.1.1 Mask Aligners"; "1.2.1.2 UV Light Sources"; "1.2.1.3 Optical Systems"; "1.2.1.4 Optical Oddities"; "1.2.2 Shadow Masks"; "1.2.3 Photoresists and Resist Processing"; "1.2.3.1 Photoresists"
- "1.2.3.2 Photoresist Processing""1.3 X-Ray Lithography"; "1.3.1 Masks for X-Ray Lithography"; "1.4 Direct-Write (E-Beam) Lithography"; "1.5 Low-Cost Photolithography"; "1.6 Photolithography
- Key Points"; "REFERENCES"; "Chapter 2"; "Silicon Micromachining"; "2.1 Introduction"; "2.2 Silicon"; "2.2.1 Miller Indices"; "2.3 Crystal Growth"; "2.4 Doping"; "2.4.1 Thermal Diffusion"; "2.4.2 Ion Implantation"; "2.5 Wafer Specifications"; "2.6 Thin Films"; "2.6.1 Materials and Deposition"; "2.6.1.1 Depositing Thin Films"; "2.6.2 Wet Etching"; "2.6.3 Dry Etching"; "2.6.3.1 Relative Ion Etching"
- "2.6.3.2 Ion-Beam Milling""2.6.4 Liftoff"; "2.7 Structures in Silicon"; "2.7.1 Bulk Silicon Micromachining"; "2.7.1.1 Pits, Mesas, Bridges, Beams, and Membranes with KOH"; "2.7.1.2 Fine Points through Wet and Dry Etching"; "2.7.1.3 RIE Pattern Transfer"; "2.7.1.4 Reflow"; "2.7.2 Surface Micromachining"; "2.7.3 Electrochemical Etching of Silicon"; "2.7.4 Porous Silicon"; "2.7.5 Wafer Bonding"; "2.8 Wafer Dicing"; "2.8.1 The Dicing Saw"; "2.8.2 Diamond and Laser Scribe"; "2.8.3 Releasing Structures by KOH Etching"; "REFERENCES"; "Chapter 3"; "Nonsilicon Processes"; "3.1 Introduction"
- "3.2 Chemical-Mechanical Polishing""3.3 LIGA and Electroplating"; "3.4 Photochemical Machining"; "3.5 Laser Machining"; "3.5.1 IR Lasers"; "3.5.2 Excimer Laser Micromachining"; "3.6 Polymer Microforming"; "3.6.1 Polyimides"; "3.6.2 Photoformable Epoxies (SU-8)"; "3.6.3 Parylene and PTFE"; "3.6.4 Dry Film Resists"; "3.6.5 Embossing"; "3.6.6 PDMS Casting"; "3.6.7 Microcontact Printing"; "3.6.8 Microstereolithography"; "3.7 Electrical Discharge Machining"; "3.8 Photostructurable Glasses"; "3.9 Precision Engineering"; "3.9.1 Roughness Measurements"; "3.10 Other Processes"; "REFERENCES"
- "Chapter 4""Mask Design"; "4.1 Introduction"; "4.2 Minimum Feature Size"; "4.3 Layout Software"; "4.3.1 File Formats"; "4.3.1.1 Technology Files"; "4.3.1.2 Further Caveats"; "4.3.2 Graphics"; "4.3.3 Grid"; "4.3.4 Text"; "4.3.5 Other Features"; "4.3.6 Manhattan Geometry"; "4.4 Design"; "4.4.1 The Frame and Alignment Marks"; "4.4.1.1 Scribe Lane"; "4.4.1.2 Alignment Marks"; "4.4.1.3 Test Structures"; "4.4.1.4 Layer and Mask Set Identification Marks"; "4.4.1.5 Putting It All Together"; "4.4.1.6 Another Way to Place Alignment Marks"; "4.4.2 The Device"; "4.5 Design Rules"