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VLSI and Post-CMOS Electronics. Devices, circuits and interconnects / Volume 2 :

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The following topics are dealt with: integrated circuit design; VLSI; technology CAD (electronics); MOSFET; III-V semiconductors; silicon; semiconductor device models; SRAM chips; three-dimensional integrated circuits; permittivity.

Bibliographic Details
Corporate Author: Knovel (Firm)
Other Authors: Dhiman, Rohit (Editor), Chandel, Rajeevan (Editor)
Format: eBook
Language:English
Published: Stevenage : IET, 2019.
Series:Materials, circuits and devices series ; 73.
Subjects:
Dielectric measurements.
Dielectrics.
Electric resistance.
Electronic apparatus and appliances.
Integrated circuits.
Integrated circuits > Computer-aided design.
Integrated circuits > Design and construction.
Integrated circuits > Very large scale integration.
Metal oxide semiconductor field-effect transistors.
Semiconductors.
Silicon.
Mesures diélectriques.
Diélectriques.
Résistance électrique.
Circuits intégrés.
Circuits intégrés > Conception assistée par ordinateur.
Circuits intégrés > Conception et construction.
Circuits intégrés à très grande échelle.
Transistors MOSFET.
Semi-conducteurs.
Silicium.
resistivity.
semiconductor.
silicon.
Dielectric measurements
Dielectrics
Electric resistance
Electronic apparatus and appliances
Integrated circuits
Integrated circuits > Computer-aided design
Integrated circuits > Design and construction
Integrated circuits > Very large scale integration
Metal oxide semiconductor field-effect transistors
Semiconductors
Silicon
CMOS integrated circuits.
elemental semiconductors.
III-V semiconductors.
integrated circuit design.
MOSFET.
permittivity.
semiconductor device models.
SRAM chips.
technology CAD (electronics)
three-dimensional integrated circuits.
VLSI.
integrated circuit design
VLSI
MOSFET
III-V semiconductors
silicon
semiconductor device models
SRAM chips
three-dimensional integrated circuits
permittivity
Electronic books.
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Call Number: QC589 .V575 2019
 
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QC589 .V575 2019 Available