Thermomechanical simulation methodologies for advanced semiconductor packaging /

Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges. It's important to be able understand and predict the thermomechanical reli...

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Bibliographic Details

Main Authors:	Zhang, Shuye (Associate professor) (Author), Sun, Guoli (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Published:	London, United Kingdom : Institution of Engineering & Technology, 2025.
Series:	Materials, circuits and devices series ; 85.
Subjects:	Microelectronic packaging. Mise sous boîtier (Microélectronique) Microelectronic packaging Electronic books.
Online Access:	Connect to the full text of this electronic book