Thermomechanical simulation methodologies for advanced semiconductor packaging /
Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges. It's important to be able understand and predict the thermomechanical reli...
| Main Authors: | , |
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| Format: | eBook |
| Language: | English |
| Published: |
London, United Kingdom :
Institution of Engineering & Technology,
2025.
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| Series: | Materials, circuits and devices series ;
85. |
| Subjects: |
Purchase on Demand
| Call Number: |
TK7870.15 .Z43 2025 |
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