Design, test, integration and packaging of MEMS/MOEMS.

Bibliographic Details
Corporate Author:	Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS
Format:	Conference Proceeding
Language:	English
Published:	[Bellingham, Wash.] : [SPIE--the International Society for Optical Engineering] Piscataway, NJ : Institute of Electrical and Electronics Engineers
Subjects:	Microelectromechanical systems > Congresses. Microelectromechanical systems > Design and construction. Optoelectronic devices > Congresses. Micromachining > Congresses. Microelectronic packaging > Congresses. Microelectromechanical systems. Microelectronic packaging. Micromachining. Optoelectronic devices. Electronic journals. Conference papers and proceedings.
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