Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits.

Bibliographic Details
Corporate Authors:	International Symposium on the Physical & Failure Analysis of Integrated Circuits, Institute of Electrical and Electronics Engineers, IEEE Singapore Section, IEEE Electron Devices Society
Format:	Conference Proceeding
Language:	English
Published:	Piscataway, N.J. : IEEE Service Center
Subjects:	Integrated circuits > Design and construction > Congresses. Integrated circuits > Testing > Congresses. Microelectronics > Research > Congresses. Integrated circuits > Design and construction. Integrated circuits > Testing. Microelectronics > Research. Electronic journals. Periodicals. Conference papers and proceedings.
Online Access:	https://ieeexplore.ieee.org/servlet/opac?punumber=8963813 http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000562
Online Availability:

Available Online