Direct Copper Interconnection for Advanced Semiconductor Technology /

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch in...

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Bibliographic Details

Corporate Author:	Taylor & Francis
Other Authors:	Shangguan, Dongkai (Editor)
Format:	eBook
Language:	English
Published:	Boca Raton : CRC Press, 2024.
Edition:	First edition.
Subjects:	Semiconductors. Semi-conducteurs. semiconductor. TECHNOLOGY / Electricity TECHNOLOGY / Engineering / Mechanical TECHNOLOGY / Superconductors & Superconductivity Electronic books.
Online Access:	Connect to the full text of this electronic book