Cover Image

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

Bibliographic Details
Main Author: Wei, Xing-Chang (Author)
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Published: Boca Raton : CRC Press, Taylor & Francis Group, [2017]
Subjects:
Printed circuits > Design and construction.
Electronic packaging.
Electromagnetic compatibility.
Mise sous boîtier (Électronique)
Compatibilité électromagnétique.
TECHNOLOGY & ENGINEERING > Mechanical.
Electromagnetic compatibility
Electronic packaging
Printed circuits > Design and construction
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Electromagnetic compatibility for high-speed circuits
  • Modal field of power-ground planes and grids
  • Integral equation solutions
  • Extraction of via parameters
  • Printed circuit board-level electromagnetic compatibility design
  • Interposer electromagnetic compatibility design
  • New structures and materials.