Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

Bibliographic Details
Main Author:	Wei, Xing-Chang (Author)
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Boca Raton : CRC Press, Taylor & Francis Group, [2017]
Subjects:	Printed circuits > Design and construction. Electronic packaging. Electromagnetic compatibility. Mise sous boîtier (Électronique) Compatibilité électromagnétique. TECHNOLOGY & ENGINEERING > Mechanical. Electromagnetic compatibility Electronic packaging Printed circuits > Design and construction Electronic books.
Online Access:	Connect to the full text of this electronic book

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