Cover Image

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

Bibliographic Details
Main Author: Wei, Xing-Chang (Author)
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Published: Boca Raton : CRC Press, Taylor & Francis Group, [2017]
Subjects:
Printed circuits > Design and construction.
Electronic packaging.
Electromagnetic compatibility.
Mise sous boîtier (Électronique)
Compatibilité électromagnétique.
TECHNOLOGY & ENGINEERING > Mechanical.
Electromagnetic compatibility
Electronic packaging
Printed circuits > Design and construction
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Physical Description:1 online resource
Bibliography:Includes bibliographical references and index.
ISBN:9781315305868
1315305860
9781315305875
1315305879
9781315305851
1315305852
9781315305844
1315305844