APA (7th ed.) Citation

Wei, X. (2017). Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging. CRC Press, Taylor & Francis Group.

Chicago Style (17th ed.) Citation

Wei, Xing-Chang. Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging. Boca Raton: CRC Press, Taylor & Francis Group, 2017.

MLA (9th ed.) Citation

Wei, Xing-Chang. Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging. CRC Press, Taylor & Francis Group, 2017.