Semiconductor Packaging : Materials Interaction and Reliability.

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...

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Bibliographic Details

Main Author:	Chen, Andrea
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Hoboken : CRC Press, 2011.
Subjects:	Microelectronic packaging. Mise sous boîtier (Microélectronique) Microelectronic packaging Electronic books. Electronic resource.
Online Access:	Connect to the full text of this electronic book Connect to the full text of this electronic book Connect to the full text of this electronic book