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Stress and strain engineering at nanoscale in semiconductor devices /

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devic...

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Bibliographic Details
Main Author: Maiti, C. K. (Author)
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Published: Boca Raton, FL : CRC Press, 2021.
Subjects:
Strains and stresses.
Semiconductors.
Nanoelectronics.
Contraintes (Mécanique)
Semi-conducteurs.
Nanoélectronique.
stress.
strain.
semiconductor.
SCIENCE > Physics.
TECHNOLOGY > Electricity.
TECHNOLOGY > Electronics > Circuits > General.
Nanoelectronics
Semiconductors
Strains and stresses
Electronic books.
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Call Number: TA405TA417.6 .M35 2021
 
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TA405TA417.6 .M35 2021 Available