Ceramic interconnect technology handbook /

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Bibliographic Details
Corporate Author:	Taylor & Francis
Other Authors:	Barlow, Fred D., Elshabini, Aicha
Format:	eBook
Language:	English
Language Notes:	English.
Published:	Boca Raton : CRC Press/Taylor & Francis, ©2007.
Subjects:	Electronic ceramics. Electronic packaging > Materials. Interconnects (Integrated circuit technology) > Design and construction. Céramique électronique. Mise sous boîtier (Électronique) > Matériaux. TECHNOLOGY & ENGINEERING > Electronics > Microelectronics. TECHNOLOGY & ENGINEERING > Electronics > Digital. Electronic ceramics Electronic packaging > Materials Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

Cover Front cover Dedication Preface Editors Contributors Contents Chapter 1. Overview of Ceramic Interconnect Technology Chapter 2. Electrical Design, Simulation, and Testing Chapter 3. ThermoMechanical Design Chapter 4. Ceramic Materials Chapter 5. Screen Printing Chapter 6. Multilayer Ceramics Chapter 7. Photo-Defined and Photo-Imaged Films Chapter 8. Copper Interconnects for Ceramic Substrates and Packages Chapter 9. Integrated Passives in Ceramic Substrates Index Back cover Last Page.