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Ceramic interconnect technology handbook /

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...

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Bibliographic Details
Corporate Author: Taylor & Francis
Other Authors: Barlow, Fred D., Elshabini, Aicha
Format: eBook
Language:English
Language Notes:English.
Published: Boca Raton : CRC Press/Taylor & Francis, ©2007.
Subjects:
Electronic ceramics.
Electronic packaging > Materials.
Interconnects (Integrated circuit technology) > Design and construction.
Céramique électronique.
Mise sous boîtier (Électronique) > Matériaux.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic ceramics
Electronic packaging > Materials
Electronic books.
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Call Number: TK7871.15.C4 C44 2007
 
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