Ceramic interconnect technology handbook /
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. Th...
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| Other Authors: | , |
| Format: | eBook |
| Language: | English |
| Language Notes: | English. |
| Published: |
Boca Raton :
CRC Press/Taylor & Francis,
©2007.
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Summary: | Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outst. |
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| Item Description: | Title from PDF of title page (CRC Press, viewed December 04, 2008). |
| Physical Description: | 1 online resource : (441 pages : illustrations) |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780849335570 0849335574 1420018965 9781420018967 1351837176 9781351837170 1315221284 9781315221281 1280729902 9781280729904 9786610729906 6610729905 |