3D integration in VLSI circuits : implementation technologies and applications /

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to pro...

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Bibliographic Details
Main Author:	Sakuma, Katsuyuki (Author)
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Boca Raton, FL : CRC Press/Taylor and Francis Group, [2018]
Series:	Devices, circuits, & systems
Subjects:	Three-dimensional integrated circuits. Integrated circuits > Very large scale integration. Circuits intégrés tridimensionnels. Circuits intégrés à très grande échelle. TECHNOLOGY & ENGINEERING > Mechanical. Three-dimensional integrated circuits Integrated circuits > Very large scale integration Computer engineering Electronics Electronic books. handbooks. Handbooks and manuals. Guides et manuels.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

3D Integration: Technology and Design / P. Franzon
3D SiP for ASIC and 3D DRAM Integration / L. Li
A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden
Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka
Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba
3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman
Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio
Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.