3D integration in VLSI circuits : implementation technologies and applications /

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to pro...

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Bibliographic Details

Main Author:	Sakuma, Katsuyuki (Author)
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Boca Raton, FL : CRC Press/Taylor and Francis Group, [2018]
Series:	Devices, circuits, & systems
Subjects:	Three-dimensional integrated circuits. Integrated circuits > Very large scale integration. Circuits intégrés tridimensionnels. Circuits intégrés à très grande échelle. TECHNOLOGY & ENGINEERING > Mechanical. Three-dimensional integrated circuits Integrated circuits > Very large scale integration Computer engineering Electronics Electronic books. handbooks. Handbooks and manuals. Guides et manuels.
Online Access:	Connect to the full text of this electronic book