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3D integration in VLSI circuits : implementation technologies and applications /

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to pro...

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Bibliographic Details
Main Author: Sakuma, Katsuyuki (Author)
Corporate Author: Taylor & Francis
Format: eBook
Language:English
Published: Boca Raton, FL : CRC Press/Taylor and Francis Group, [2018]
Series:Devices, circuits, & systems
Subjects:
Three-dimensional integrated circuits.
Integrated circuits > Very large scale integration.
Circuits intégrés tridimensionnels.
Circuits intégrés à très grande échelle.
TECHNOLOGY & ENGINEERING > Mechanical.
Three-dimensional integrated circuits
Integrated circuits > Very large scale integration
Computer engineering
Electronics
Electronic books.
handbooks.
Handbooks and manuals.
Guides et manuels.
Online Access:Connect to the full text of this electronic book

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