Nano-interconnect materials and models for next generation integrated circuit design /

"Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D...

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Bibliographic Details
Corporate Author: Taylor & Francis
Other Authors: Bhattacharya, Sandip (Professor of electrical engineering) (Editor), J., Ajayan (Editor), Herrera, Fernando Avila (Editor)
Format: eBook
Language:English
Published: Boca Raton, FL : CRC Press, 2024.
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Call Number: TK7874.84
 
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