Design of 3D integrated circuits and systems /

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the...

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Bibliographic Details

Corporate Author:	Taylor & Francis
Other Authors:	Sharma, Rohit, Iniewski, Krzysztof, 1960-, Lim, Sung Kyu
Format:	eBook
Language:	English
Published:	Boca Raton, FL : CRC Press, ©2015. ©2015
Series:	Devices, circuits, and systems.
Subjects:	Three-dimensional integrated circuits. Circuits intégrés tridimensionnels. TECHNOLOGY & ENGINEERING > Mechanical. Three-dimensional integrated circuits Electronic books.
Online Access:	Connect to the full text of this electronic book