Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, esp...
| Main Authors: | , |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Boca Raton :
Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc,
2018.
|
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Summary: | As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, includingelectrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects. |
|---|---|
| Physical Description: | 1 online resource |
| ISBN: | 9780367023430 0367023431 9780429399619 0429399618 9780429680052 0429680058 9780429680069 0429680066 9780429680076 0429680074 |