Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, esp...

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Bibliographic Details
Main Authors:	Ma, Yue (Electronics engineer) (Author), Gontrand, Christian (Author)
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc, 2018.
Subjects:	Three-dimensional integrated circuits. Circuits intégrés tridimensionnels. TECHNOLOGY & ENGINEERING > Mechanical. COMPUTERS > Networking > General. TECHNOLOGY > Electricity. TECHNOLOGY > Electronics > Circuits > General. Three-dimensional integrated circuits Electronic books.
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Call Number:		TK7874.893 .M33 2019

TK7874.893 .M33 2019	Available