Ma, Y., & Gontrand, C. (2018). Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement. Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc.
Chicago Style (17th ed.) CitationMa, Yue, and Christian Gontrand. Power, Thermal, Noise, and Signal Integrity Issues on Substrate/interconnects Entanglement. Boca Raton: Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc, 2018.
MLA (9th ed.) CitationMa, Yue, and Christian Gontrand. Power, Thermal, Noise, and Signal Integrity Issues on Substrate/interconnects Entanglement. Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T & F Informa, plc, 2018.