Mechanical analysis of electronic pakaging systems /

Bibliographic Details
Main Author:	McKeown, Stephen A.
Corporate Author:	Taylor & Francis
Format:	eBook
Language:	English
Published:	New York : Marcel Dekker, ©1999.
Series:	Mechanical engineering (Marcel Dekker, Inc.) ; 120.
Subjects:	Electronic packaging. Mechanical engineering. System analysis. Mise sous boîtier (Électronique) Génie mécanique. Analyse de systèmes. mechanical engineering. systems analysis. TECHNOLOGY & ENGINEERING > Electronics > Microelectronics. TECHNOLOGY & ENGINEERING > Electronics > Digital. Electronic packaging Mechanical engineering System analysis Elektronisches Bauelement Gehäuse Mechanische Beanspruchung Electronic books.
Online Access:	Connect to the full text of this electronic book

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