Polymeric materials for electronics packaging and interconnection : developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988 /

Bibliographic Details
Corporate Authors:	American Chemical Society. Division of Polymeric Materials: Science and Engineering, American Chemical Society. Division of Polymer Chemistry, American Chemical Society. Meeting
Other Authors:	Lupinski, John H., 1927-, Moore, Robert S., 1933-
Format:	eBook
Language:	English
Published:	Washington, DC : American Chemical Society, 1989.
Series:	ACS symposium series ; 407.
Subjects:	Electronic packaging > Materials > Congresses. Polymers > Congresses. Mise sous boîtier (Électronique) > Matériaux > Congrès. Polymères > Congrès. TECHNOLOGY & ENGINEERING > Industrial Design > Packaging. Electronic packaging > Materials Polymers Electronic books. Conference papers and proceedings
Online Access:	Connect to the full text of this electronic book

Available Online