Table of Contents:
  • Lithography with a pattern of block copolymer microdomains as a positive or negative resist / Christopher Harrison, Miri Park, Paul M. Chaikin, Richard A. Register, and Douglas H. Adamson
  • Inorganic nanostructures on surfaces using micellar diblock copolymer templates / Joachim P. Spatz, Thomas Herzog, Stefan Mössmer, Paul Ziemann, and Martin Möller
  • Synthesis of stereoregular polymers as precursors to highly conducting carbon for use in applications in micro- and nanolithography / C.B. Gorman, R.W. Vest, J.L. Snover, T.L. Utz, and S.A. Serron
  • Metallization on poly(tetrafluoroethylene) substrate by excimer-laser-induced surface reaction and chemical plating / Hiroyuki Niino and Akira Yabe
  • An inorganic approach to photolithography : the photolithographic deposition of dielectric metal oxide films / Ross H. Hill and Sharon L. Blair
  • Molding of polymeric microstructures / T. Hanemann, V. Piotter, R. Ruprecht, and J.H. Hausselt
  • Acid labile cross-linked units : a concept for improved positive deep-UV photoresists / H.-T. Schacht, P. Falcigno, N. Münzel, R. Schulz, and A. Medina
  • Chemistry of ketal resist system and its lithographic performance / Wu-Song Huang, Kim Y. Lee, Rao Bantu, Ranee Kwong, Ahmad Katnani, Mahmoud Khojasteh, William Brunsvold, Steven Holmes, Ronald Nunes, Tsuyoshi Shibata, George Orsula, James Cameron, Dominic Yang, and Roger Sinta
  • Photoacid diffusion in chemically amplified DUV resists / Toshiro Itani, Hiroshi Yoshino, Shuichi Hashimoto, Mitsuharu Yamana, Norihiko Samoto, and Kunihiko Kasama
  • Highly photosensitive diazo compounds as photoacid generators for chemically amplified resists / Kieko Harada, Masahito Kushida, Kyoichi Saito, Kazuyuki Sugita, and Hirotada Iida
  • Exploration of chemically amplified resist mechanisms and performance at small linewidths / James W. Taylor, Paul M. Dentinger, Steven J. Rhyner, and Geoffrey W. Reynolds
  • The preparation and investigation of macromolecular architectures for microlithography by "living" free radical polymerization / G.G. Barclay, M. King, A. Orellana, P.R.L. Malenfant, R. Sinta, E. Malmstrom, H. Ito, and C.J. Hawker
  • Acid proliferation reactions and their application to chemically amplified lithographic imaging / Kunihiro Ichimura, Koji Arimitsu, Soh Noguchi, and Kazuaki Kudo
  • Deprotection kinetics of alicyclic polymer resist systems designed for ArF (193 nm) lithography / Uzodinma Okoroanyanwu, Jeffrey D. Byers, Ti Cao, Stephen E. Webber, and C. Grant Willson
  • 193 nm single layer resist based on poly(norbornene-alt-maleic anhydride) derivatives : the interplay of the chemical structure of components and lithographic properties / F.M. Houlihan, A. Timko, R. Hutton, R. Cirelli, J.M. Kometani, Elsa Reichmanis, and O. Nalamasu
  • Synthesis and evaluation of alicyclic backbone polymers for 193 nm lithography / Hiroshi Ito, Norbert Seehof, Rikiya Sato, Tomonari Nakayama, and Mitsuru Ueda
  • Progress in 193-nm single layer resists: the role of photoacid generator structure on the performance of positive resists / Robert D. Allen, Juliann Opitz, Carl E. Larson, Thomas I. Wallow, Richard A. DiPietro, Gregory Breyta, Ratnam Sooriyakumaran, and Donald C. Hofer
  • Calixarene and dendrimer as novel photoresist materials / Osamu Haba, Daisuke Takahashi, Kohji Haga, Yoshimasa Sakai, Tomonari Nakayama, and Mitsuru Ueda
  • Calixarene resists for nanolithography / Yoshitake Ohnishi, Naoko Wamme, and Jun-ichi Fujita
  • Design and preliminary studies of environmentally enhanced water-castable, water-developable positive tone resists : model and feasibility studies / Jennifer M. Havard, Dario Pasini, Jean M.J. Fréchet, David Medeiros, Shintaro Yamada, and C. Grant Willson
  • Molecular design for new positive electron-beam resists / Yukio Nagasaki
  • The influence of structure on dissolution inhibition for novolac-based photoresists : adaption of the probabilistic approach / Christopher L. McAdams, Wang Yueh, Pavlos Tsiartas, Dale Hsieh, and C. Grant Willson
  • Photoacid generating polymers for surface modification resists / Masamitsu Shirai, Mitsuho Masuda, Masahiro Tsunooka, Masayuki Endo, and Takahiro Matsuo
  • Material design and development for aqueous base compatible high-performance deep UV negative-tone resists / Pushkara Rao Varanasi, Hiroshi Ito, Phil Brock, Gregory Breyta, William R. Brunsvold, and Ahmad D. Katnani
  • Advanced chemically amplified resist process using non-ammonia generating adhesion promoter / M. Endo and A. Katsuyama
  • Post-exposure bake kinetics in epoxy novolac-based chemically amplified resists / P. Argitis, S. Boyatzis, I. Raptis, N. Glezos, and M. Hatzakis
  • Alkali-developable positive-photosensitive polyimide based on diazonaphthoquinone sensitizer / T. Ueno, Y. Okabe, T. Miwa, Y. Maekawa, and G. Rames-Langlade.