Cover Image

Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /

Bibliographic Details
Corporate Authors: American Chemical Society. Division of Polymeric Materials: Science and Engineering, Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division, American Chemical Society. Meeting
Other Authors: Reichmanis, Elsa, 1953-
Format: eBook
Language:English
Published: Washington, DC : American Chemical Society, 1995.
Series:ACS symposium series ; 614.
Subjects:
Microelectronic packaging > Materials > Congresses.
Polymers > Congresses.
Photoresists > Congresses.
Mise sous boîtier (Microélectronique) > Matériaux > Congrès.
Polymères > Congrès.
Résines photosensibles > Congrès.
TECHNOLOGY & ENGINEERING > Mechanical.
Microelectronic packaging > Materials
Photoresists
Polymers
Microélectronique > Matériaux.
Polymères.
Résines photosensibles.
Appareils électroniques > Emballage.
Electronic books.
Conference papers and proceedings
Online Access:Connect to the full text of this electronic book
Description
Item Description:Title from PDF title page (ACS publications, viewed August 27, 2009).
Physical Description:1 online resource (xii, 563 pages) : illustrations
Format:Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Bibliography:Includes bibliographical references and indexes.
ISBN:9780841215504
0841215502