Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /

Bibliographic Details
Corporate Authors:	American Chemical Society. Division of Polymeric Materials: Science and Engineering, Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division, American Chemical Society. Meeting
Other Authors:	Reichmanis, Elsa, 1953-
Format:	eBook
Language:	English
Published:	Washington, DC : American Chemical Society, 1995.
Series:	ACS symposium series ; 614.
Subjects:	Microelectronic packaging > Materials > Congresses. Polymers > Congresses. Photoresists > Congresses. Mise sous boîtier (Microélectronique) > Matériaux > Congrès. Polymères > Congrès. Résines photosensibles > Congrès. TECHNOLOGY & ENGINEERING > Mechanical. Microelectronic packaging > Materials Photoresists Polymers Microélectronique > Matériaux. Polymères. Résines photosensibles. Appareils électroniques > Emballage. Electronic books. Conference papers and proceedings
Online Access:	Connect to the full text of this electronic book

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