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Reliability of RoHS-Compliant 2D and 3D IC interconnects /

"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...

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Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: McGraw-Hill Companies
Format: eBook
Language:English
Language Notes:In English.
Published: New York, N.Y. : McGraw-Hill Education, [2011]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Interconnects (Integrated circuit technology) > Reliability.
Green technology > Reliability.
Electronic books.
Online Access:Connect to the full text of this electronic book

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